封装形式的英语翻译是" BGA"，还经常被译作 TSOP，在《大课标百科词典》中，共找到52个与封装形式相关的释义和例句。
1. Does it have good encapsulation?
2. it was only pro forma. Pro forma!
3. The present invention provides a multichip package, including a plurality of storage chips and control chips.
译文:本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。
7. Services encapsulate reusable business function.
8. SSiP Small Outline Single-Line Plug Package
9. it's in an envelope over there on the mantelpiece.
10. - We should have used a manila envelope.
11. The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DiP) and in an 8-pin, small outline iC (SOiC)."
译文:该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
12. Thermo-mechanical fatigue is one of the major failure modes in plastic electronic packages.
译文:热-机械疲劳失效是塑封微电子封装器件的主要失效形式。
13. package, plastic leadless chip carrier (PLCC)
14. This article compiled protel components commonly used in packaging.
15. - Which we believe to be here. - No problem.
本文来自投稿，不代表逐光英语立场，如若转载，请注明出处
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